Adhesive bonds are particularly favored by lightweight structures due to their weight efficiency and insulating property regarding contact corrosion. However, it is challenging to interrogate directly over the bonding area due to its sandwiched structure. In this study, an inkjet-printed carbon nanotube (CNT) strain distribution sensing film is embedded at the interface between an adherend and the adhesive in a single-lap joint configuration to monitor the spatial strain distribution over the bonding area. The conductivity distribution reconstructed by an algorithm of electrical impedance tomography (EIT) results in similar trend to the correlated conductivity distribution numerically calculated from a three-dimensional (3D) finite element model. Moreover, the EIT result of a defect-embedded testing specimen shows a different conductivity distribution compared to the healthy specimen, indicating the existence of the debonding region.